- Manufacturer：
-
- CTS Corporation (8)
- Wakefield Thermal (12)
- Material：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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22 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
11
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR HOR... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR .90"H... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR 1.0"H... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 21MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK HORZ MN... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEATSINK |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1 |
3,000
In-stock
|
Get Quote |
