- Manufacturer：
-
- CTS Corporation (1)
- Type：
-
- Package Cooled：
-
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK DUAL HO... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1 |
3,000
In-stock
|
Get Quote |
