- Manufacturer:
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- CUI Devices (1)
- Material:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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4 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK TO-220 W/S... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK TO-220 W/S... |
1,000 |
3,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK TO-220 VR... |
1 |
8,102
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,991
In-stock
|
Get Quote |