- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEAT SINK BGA/PGA... |
1 |
2,980
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1 |
556
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1 |
537
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | TO-263 HEAT SINK AN... |
1 |
111
In-stock
|
Get Quote |
