- Manufacturer：
-
- Hirose (1)
- JAE Electronics (1)
- Molex (3)
- WEC (1)
- Part Status：
-
- Features：
-
- Number of Positions：
-
- Contact Finish：
-
- Contact Finish Thickness：
-
- Connector Type：
-
- Insertion, Removal Method：
-
7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Molex | MSD/NSIM COMBO 2.0... |
1 |
41,636
In-stock
|
Get Quote | ||
|
|
Hirose | CONN SOCKET MICR... |
1 |
17,534
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | CONN COMBO CARD P... |
1 |
500
In-stock
|
Get Quote | ||
|
|
Molex | MSD/NSIM 3IN2 1.45H ... |
3,600 |
3,000
In-stock
|
Get Quote | ||
|
|
JAE Electronics | COMBO MICRO SD/NA... |
1 |
1,151
In-stock
|
Get Quote | ||
|
|
WEC | CONN COMBO CARD P... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Molex | 3IN2 ANTI CRUSH CN... |
1 |
3,000
In-stock
|
Get Quote |
